Inspection Technology for Solder Joint.
نویسندگان
چکیده
منابع مشابه
Stacked solder bumping technology for improved solder joint reliability
Reliability in flip chip and Ball Grid Array is a major concern. Solder joint geometry is extremely important from a reliability point of view. Commonly, the flip chip solder bump takes on the shape of a spherical segment. Mathematical calculations and finite element modeling have shown that the hourglass-shaped solder bumps experience the lowest plastic strain and have the longest lifetime. In...
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This paper reports, for the first time, the use of endoscopy for the nondestructive examination of solder joint integrity in chip scale packages (CSP) such as flip chip on flex (FCF). Borrowed from the medical instrument technology, the endoscope is used to examine visually the inside of an organ. This concept has now been developed and refined by ERSA and KURTZ, and led to an ERSASCOPE inspect...
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ژورنال
عنوان ژورنال: HYBRIDS
سال: 1992
ISSN: 1884-1171,0914-2568
DOI: 10.5104/jiep1985.8.3_18